# Carbice® Pad

The no-compromise TIM delivering best-in-class performance for both small and large surface area cooling.

AS9100D & ISO9001 Certified

Meet Carbice Pad

## Tell us what challenges you’re facing, and we’ll work with you to find the best solution.

TELL US ABOUT YOURSELF:

Market or Industry

- Data Center & Server
- Power Systems
- Consumer Electronics
- Aerospace & Defense
- Telecommunications
- Automotive
- Other

TELL US WHAT YOU’RE SOLVING FOR:

1. Assembly and rework issues with thermal grease, PCM, or adhesive
2. Consistency of application challenges with current thermal solution
3. PCM or adhesive cold rework cracking device or damaging chip
4. Loss of performance or unplanned failures with thermal grease or PCM
5. Difficulty making full contact to large curved devices or heat sinks
6. Challenging thermal design and qualification needs
7. Devices overheating in current design
8. Current thermal solution not able to survive use environment effectively
9. Lead times too long with current solution

**High-Performance Grease C-SAM Analysis**

Grease was applied only at the center of the interface (within the dotted circle).

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

_Takeaway:_

After only ~50 cycles, the grease has completely dried out.

**High-Performance PCM C-SAM Analysis**

PCM was applied over the entire interface.

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

_Takeaway:_

Air voids migrate around interface with PCM.

**Carbice Pad C-SAM Analysis**

Carbice Pad IP150 was applied over the entire interface.

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

_Takeaway:_

Carbice Pad cause no interface degradation throughout the 2000 test cycles.

**Coupon thermal resistance change due to thermal cycling**

Thermal cycling performed from -55 °C to 110 °C for 2000 cycles, according to modified JEDEC standard JESD22-A104F condition L. Thermal conductance measured using ASTM D5470 standard testing method.

Thermal interface quality degrades with increasing cycles for conventional TIMs:

- After 2000 cycles the thermal resistance of grease is 2.6 times that of Carbice Pad
- After 2000 cycles the thermal resistance of PCM is 1.4 times that of Carbice Pad

Using Carbice Pad, customers are able to:

- Remove heat effectively and reliably over time
- Expect less de-rating of electronics over time
- Build higher performance electronics that last longer
- Generate less e-waste and be more sustainable

### Carbice® Pad enables better cooling for GPU

**The challenge of GPU heat management**

GPUs are incorporated by data centers to handle increasingly intensive workloads:

- They are affected by large thermal variances during operation
- Heat buildup reduces GPU’s performance, stability and lifespan
- Reliability of data centers will be compromised

**Meet Carbice Pad**

Carbice Pad provides high thermal conductivity of a solid TIM and low thermal resistance of a liquid TIM, with reliable long-term performances and high volume manufacturability. For this study, we used IP90 with 2-sided assembly tack.

Carbice Pad demonstrated immediate better cooling and long-term gains to GPU performance compared to POR Grease:

- 2℃ cooler upon initial installation
- > 6℃ cooler after extended use

Over time, grease pumps-out and develops dry-cracks, causing its thermal resistance to double after extended use. On the contrary, Carbice Pad wets the interface even better with time and cycling.

_Takeaway:_

Carbice Pad provides better lifetime cooling performance than grease.

**Using Carbice Pad, customers are able to:**

- Lower GPU temperature
- Boost GPU performance
- Extend GPU lifespan
- Increase data center reliability